1～3 件を表示 ／ 全 3 件
Ideal as a substitute for aluminum, copper, and AlSic (heat spreader).
It is a new material with a balanced set of properties, featuring thermal conductivity second only to diamond, higher than copper, and a thermal expansion that is as small as that of ceramics, with a specific gravity of less than one-fourth that of copper.
A new material with a characteristic balance not found in conventional materials: high thermal conductivity comparable to ceramics/aluminum substrates and low thermal expansion similar to ceramics.
● A new material that has never existed before: a composite of aluminum and graphite ● A new material with a characteristic balance not found in conventional materials: high thermal conductivity comparable to ceramics/aluminum substrates and low thermal expansion similar to ceramics ● A new material with expanded applications beyond heat dissipation components: high strength and high Young's modulus ● A new material with excellent machinability: can be processed with standard machining tools
High rigidity heat dissipation structural members (sub-heat spreaders, heat spreaders, heat sinks, etc.)
A new material that compensates for the shortcomings of aluminum and copper: lighter than copper, stronger than aluminum, with a thermal expansion rate comparable to titanium, and a well-balanced thermal conductivity.
